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reliability test

with the reliability experiment from 168 hours to 500 hours, not only the change of the optical power parameter is smaller, but the sensitivity is getting better and better with the lengthening performance of the experiment time. this discovery subverts the traditional data of product reliability experiment.

the general result of the traditional reliability experiment is that the performance of the product becomes worse and worse with the extension of the reliability experiment time, and then it is close to scrap.

but gigalight draws the same conclusion through repeated validation of the transceiver module after changing the test conditions: product reliability experiments enhance product quality and transmission performance.

the experimental results show that:

100g cob technology can be passed through industrial reliability standards. therefore, we do not need to reduce the reliability requirement because big data has better environment than telecommunications.
2)100g air tightness design can improve long-term performance through reliability test. this indicates that reliability is a necessary factor rather than an avoidance factor in the manufacture of 100g.

advantages of cob packaging

low cost

small size

good sealing

mature tech

automation

cob tech is aimed to reduce costs and saving investments. due to that uncovered ic chip is directly attached on the printed circuit board, without separate packaging for ic chip, so that the cost is reduced. and making the circuit interconnection line directly on the ic chip saves more costs than advanced packaging. therefore, cob tech tends to be developed toward more improved ic chip.

on account that ic chip is smaller than components with leading spacing, cob has outstanding advantages in space saving. the size of wire bonding chip without ic packaging is smaller than that of the dual-in-line packaging, covering about 1/4, saving more space than leaded chip carrier (lcc) packaging, shrinking the size. cob tech can also be used in the application fields that other packaging have no way to achieve it.

with the coefficient of thermal expansion between sealing materials and printed circuit board more and more matched, the reliability will be further improved. in the past, on account of the mismatching of coefficient of thermal expansion between sealant and printed circuit board, excessive strain are generated in the welding spot between the chip and printed circuit board. with the development of sealing materials, this issue is not very obvious. therefore, cob tech is more attractive in more fields.

in the aspect of semiconductor tech, it is also developed towards cob tech. cmos component with low power dissipation is more suitable for cob tech with limited power. simultaneously, with the ic chip developed toward the trend of consumption and semi-consumption, cob tech is more important.

many processes included in the cob tech can realize automatic production. after that, many manufacturers will be more interested in cob tech.